Welcome to the official website of Shenzhen Xindingchen Electronic Technology Co., Ltd.!
13828822083 / 13590113894 / 18476339884 Sales@Xdctech.com.cn 中文

You are here: Home >> News >> Shielding, Grounding and Thermal Management Adhesives in Laptop Assembly

Contact

Shenzhen Xindingchen Electronic Technology Co., Ltd.

Tel: 13828822083
13590113894
18476339884
Email: Sales@Xdctech.com.cn
Address: Room 3030, Jinsheng Building, No. 19 Zhongxing Road, Nanwan Street, Longgang District, Shenzhen

News

Shielding, Grounding and Thermal Management Adhesives in Laptop Assembly

2026-08-08  |  Company News

The display section focuses on bonding and cushioning: screen bonding commonly uses the SR7600 series, cushioning foam uses 86415/86420, and the front frame mostly uses structural tapes such as VHB4914 and VHB5981 to ensure long-term bond strength.

The mainboard and cable area focuses on shielding and grounding: display modules, back covers and fans use MSG7000 and MSG70 series conductive tapes for grounding, cable shielding uses 1060TC, and panel light blocking uses light-blocking tapes such as 3304BC-S and CEF-3BV.

For thermal management, thermal pads and thermal gels (such as 5590H and the 5516/5519 series) fill the gap between chips and heat sink modules, working together with structural adhesives that fix the back cover and decorative panels to form a complete device-level solution.

Projects
QR CodeScan to view on mobile
Hotline: 13828822083
13590113894
18476339884

Email: Sales@Xdctech.com.cn

Website: https://www.xdctech.com.cn

Copyright © 2026 深圳市欣鼎宸电子科技有限公司 版权所有 粤ICP备2026171365号-1

13828822083

Website QR Code

◉●Home ◉●Products ◉●News ◉●Contact Us