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Shenzhen Xindingchen Electronic Technology Co., Ltd.
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Transfer tapes (unsupported adhesive films) consist of pure pressure-sensitive adhesive and release paper. They can be made extremely thin and have almost no rigidity after lamination, making them ideal for fine bonding of FPC to foam, brackets and housings.
| Model | Substrate / Features | Typical Applications |
|---|---|---|
| 467MP | Unsupported acrylic adhesive; ultra-thin | FPC bonding, foam bonding, keyboard circuit board bonding, module bonding |
| 468MP | Unsupported; higher bond strength | Keyboard circuit board bonding, structural part bonding |
| 200MP | Unsupported; good temperature resistance | Foam bonding, decorative panel bonding |
| 9471LE | Unsupported; low adhesive bleed | FPC bonding, fine structural bonding |
| 8228B / 8229B | Unsupported | Keyboard circuit board bonding |
Processing: available as rolls, sheets and die-cut parts for use with automated placement equipment.
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Website: https://www.xdctech.com.cn
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